Backplane and glass-based circuit board

ABSTRACT

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units ( 110 ) includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line ( 200 ) and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The light-emitting diode chips ( 300 ) in the at least one light-emitting sub-unit are connected in series.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This application is a U.S. National Stage Application under 35 U.S.C. §371 of International Patent Application No. PCT/CN2019/109452, filedSep. 30, 2019, which is incorporated by reference in its entirety.

TECHNICAL FIELD

At least one embodiment of the present disclosure relates to a backplaneand a glass-based circuit board.

BACKGROUND

With development of a micro light-emitting diode chip technology,backlight sources using micro light-emitting diode chips have beenwidely applied. In a general backlight source, a printed circuit board(PCB) is usually used to electrically connect a plurality of the microlight-emitting diode chips or electrically connect the microlight-emitting diode chips with other devices.

SUMMARY

At least one embodiment of the disclosure provides a backplane and aglass-based circuit board.

At least one embodiment of the disclosure provides a backplane,comprising a base substrate and a plurality of light-emitting units,arranged in an array on the base substrate. Each of the plurality of thelight-emitting units comprises at least one light-emitting sub-unit; theat least one light-emitting sub-unit comprises a connection line and aplurality of light-emitting diode chips connected with the connectionline; the plurality of the light-emitting diode chips are located on aside of the connection line away from the base substrate; and theplurality of the light-emitting diode chips in the at least onelight-emitting sub-unit are connected in series.

In some examples, in each of the light-emitting sub-units, theconnection line comprises a first connection portion and a secondconnection portion; the first connection portion comprises a first inputend; the second connection portion comprises a second input end; and thefirst connection portion and the second connection portion respectivelycomprise an electrical contact point; the connection line furthercomprises a third connection portion; both ends of the third connectionportion respectively comprise an electrical contact point; theelectrical contact point at one end of the third connection portion andthe electrical contact point of the first connection portion constitutean electrical contact point pair; the electrical contact point at theother end of the third connection portion and the electrical contactpoint of the second connection portion constitute an electrical contactpoint pair; and each of the electrical contact point pairs isrespectively connected with an anode and a cathode of one of theplurality of the light-emitting diode chips in one-to-onecorrespondence.

In some examples, in each of the light-emitting sub-units, the thirdconnection portion comprises a plurality of connection sub-portions;both ends of each of the connection sub-portions respectively comprisean electrical contact point; the electrical contact points at adjacentends of adjacent connection sub-portions constitute an electricalcontact point pair; each of the electrical contact point pairs isrespectively connected with an anode and a cathode of one of theplurality of the light-emitting diode chips in one-to-onecorrespondence; and the plurality of the connection sub-portions areconnected in series by the light-emitting diode chips.

In some examples, the plurality of the connection sub-portions comprisea first connection sub-portion and a second connection sub-portion, thefirst connection sub-portion extends along a first direction parallel tothe base substrate; the first connection sub-portion has a shape inwhich notches are formed at two corners of a substantially rectangularshape that are opposite to each other in a diagonal direction; the firstconnection sub-portion comprises connection regions corresponding to thenotches; and an electrical contact point of the first connectionsub-portion is located on a side of the connection region facing thenotch, the second connection sub-portion extends along the seconddirection parallel to the base substrate and intersecting with the firstdirection; electrical contact points of the second connectionsub-portion are located at both end portions of the second connectionsub-portion in the second direction.

In some examples, the light-emitting sub-unit comprises a plurality offirst connection sub-portion rows extending along the first directionand arranged in the second direction; each of the first connectionsub-portion rows comprises at least one first connection sub-portion;two end portions of the second connection sub-portion are respectivelylocated in notches opposite to each other at end portions of adjacentfirst connection sub-portion rows, so that the adjacent first connectionsub-portion rows are connected with each other by the second connectionsub-portion and the light-emitting diode chips, the second connectionsub-portions connected with a same first connection sub-portion row bythe light-emitting diode chips are respectively located on both sides ofthe same first connection sub-portion row in the second direction andare respectively located at both ends of the same first connectionsub-portion row in the first direction.

In some examples, each of the first connection sub-portion rowscomprises a plurality of the first connection sub-portions; and aconnection region of one first connection sub-portion of adjacent firstconnection sub-portions is located in the notch of the other firstconnection sub-portion of the adjacent first connection sub-portions, sothat the adjacent connection regions are electrically connected by thelight-emitting diode chip.

In some examples, each of the first connection sub-portion rowscomprises a first end portion and a second end portion; the first endportions of the plurality of the connection sub-portion rows are alignedin the second direction; the second end portions of the plurality of thefirst connection sub-portion rows are aligned in the second direction;and the plurality of the first connection sub-portion rows and thesecond connection sub-portions are integrally connected in a square waveshape.

In some examples, except the connection regions located at both ends ofthe first connection sub-portion row, the first connection sub-portionrow has a substantially equal size in the second direction at respectivepositions in the first direction.

In some examples, the first connection portion comprises a firstprotrusion portion; the first protrusion portion is located within anotch at a connection region of the first connection sub-portion rowconnected with the first protrusion portion by the light-emitting diodechip; the second connection portion comprises a second protrusionportion; and the second protrusion portion is located within a notch ata connection region of the first connection sub-portion row connectedwith the second protrusion portion by the light-emitting diode chip.

In some examples, the at least one light-emitting sub-unit comprises aplurality of light-emitting sub-units; and the plurality of thelight-emitting sub-units of each of the light-emitting units share thefirst connection portion and the second connection portion, so that theplurality of the light-emitting sub-units are connected in parallel.

In some examples, the light-emitting diode chips in each of thelight-emitting units are evenly distributed.

In some examples, the two connection portions constituting theelectrical contact point pair have a space therebetween, and anorthogonal projection of the light-emitting diode chip on the basesubstrate at least partially overlaps with an orthogonal projection ofthe space on the base substrate.

In some examples, the backplane further comprises a reflective layer,located between the connection line and the light-emitting diode chip.

In some examples, the backplane further comprises a plurality of wiringsparallel to each other, located on a side of the connection line facingthe base substrate, and including a plurality of first wirings and aplurality of second wirings; a first insulation layer, located betweenthe plurality of the wirings parallel to each other and the connectionline; a second insulation layer, located between the reflective layerand the connection line, to isolate the reflective layer and theconnection line from each other. The first input end of the connectionline is connected with the first wiring, and the second input end of theconnection line is connected with the second wiring.

In some examples, a thickness of the wiring is greater than a thicknessof the connection line, and widths of both of the first connectionportion and the second connection portion are greater than a width ofthe wiring.

In some examples, the backplane further comprises a white glue layer, ona side of the reflective layer away from the base substrate, and havingan opening exposing the light-emitting diode chips; a transparent layer,on a side of the white glue layer away from the base substrate to coverthe white glue layer and the light-emitting diode chips.

At least one embodiment of the present disclosure provides a glass-basedcircuit board, comprising a glass substrate; and a plurality ofconnection line units, arranged in an array on the glass substrate. Eachof the connection line units comprises at least one connection linesub-unit; the connection line sub-unit comprises a plurality ofelectrical contact point pairs; each of the electrical contact pointpairs is configured to be connected with an anode and a cathode of alight-emitting diode chip in one-to-one correspondence, so that aplurality of the light-emitting diode chips connected with the pluralityof the electrical contact point pairs are connected in series.

In some examples, the connection line sub-unit comprises a firstconnection portion and a second connection portion; the first connectionportion comprises a first input end; the second connection portioncomprises a second input end; and the first connection portion and thesecond connection portion respectively comprise an electrical contactpoint; the connection line sub-unit further comprises a third connectionportion; both ends of the third connection portion respectively comprisean electrical contact point; the electrical contact point at one end ofthe third connection portion and the electrical contact point of thefirst connection portion constitute the electrical contact point pair;the electrical contact point at the other end of the third connectionportion and the electrical contact point of the second connectionportion constitute the electrical contact point pair.

In some examples, in each of the connection line sub-units, the thirdconnection portion comprises a plurality of connection sub-portions;both ends of each of the connection sub-portions respectively comprisean electrical contact point; the plurality of the connectionsub-portions are adjacent head to tail, so that adjacent electricalcontact points of the adjacent connection sub-portions constitute theelectrical contact point pair.

In some examples, the plurality of the connection sub-portions comprisea first connection sub-portion and a second connection sub-portion, thefirst connection sub-portion extends along a first direction parallel tothe glass substrate; the first connection sub-portion has a shape inwhich notches are formed at two corners of a substantially rectangularshape that are opposite to each other in a diagonal direction; the firstconnection sub-portion comprises connection regions corresponding to thenotches; and an electrical contact point of the first connectionsub-portion is located on a side of a connection region facing thenotch, the second connection sub-portion extends along a seconddirection parallel to the glass substrate and intersecting with thefirst direction; electrical contact points of the second connectionsub-portion are located at both end portions of the second connectionsub-portion in the second direction.

In some examples, the connection line sub-unit comprises a plurality offirst connection sub-portion rows extending along the first directionand arranged in the second direction; each of the first connectionsub-portion rows comprises at least one first connection sub-portion;two end portions of the second connection sub-portion are respectivelylocated in notches at end portions of adjacent first connectionsub-portion rows, so that the electrical contact points at the two endportions of the second connection sub-portion respectively constitutethe electrical contact point pair with the electrical contact point ofan adjacent first connection sub-portion row, the second connectionsub-portions forming the electrical contact point pairs with a samefirst connection sub-portion row are respectively located on both sidesof the first connection sub-portion row in the second direction and arerespectively located at both ends of the first connection sub-portionrow in the first direction.

In some examples, each of the first connection sub-portion rowscomprises a plurality of first connection sub-portions; and a connectionregion of one first connection sub-portion of adjacent first connectionsub-portions is located in a notch of the other first connectionsub-portion.

In some examples, except the connection regions located at both ends ofthe first connection sub-portion row, the first connection sub-portionrow has a substantially equal size in the second direction at respectivepositions in the first direction.

In some examples, the first connection portion comprises a firstprotrusion portion, the electrical contact point of the first connectionportion is located on the first protrusion portion, and the firstprotrusion portion is located within a notch corresponding to aconnection region of the first connection sub-portion row adjacent tothe first connection portion, so that an electrical contact point on thefirst protrusion portion and an electrical contact point in theconnection region of the first connection sub-portion row constitute theelectrical contact point pair; the second connection portion comprises asecond protrusion portion, an electrical contact point of the secondconnection portion is located on the second protrusion portion, and thesecond protrusion portion is located within a notch corresponding to aconnection region of the first connection sub-portion row adjacent tothe second protrusion portion, so that the electrical contact point onthe second protrusion portion and an electrical contact point in theconnection region of the first connection sub-portion row constitute theelectrical contact point pair.

In some examples, the at least one connection line sub-unit comprises aplurality of connection line sub-units; and the plurality of theconnection line sub-units in each of the connection line units share thefirst connection portion and the second connection portion.

In some examples, the electrical contact point pairs in each of theconnection line units are evenly distributed.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to clearly illustrate the technical solution of the embodimentsof the disclosure, the drawings of the embodiments will be brieflydescribed in the following; it is obvious that the described drawingsare only related to some embodiments of the disclosure and thus are notlimitative of the disclosure.

FIG. 1 is a partial planar structural schematic diagram of a backplaneprovided by an embodiment of the present disclosure;

FIG. 2 is a planar structural schematic diagram of a light-emitting unitin the backplane shown in FIG. 1;

FIG. 3 is a planar structural schematic diagram of a third connectionportion in the light-emitting sub-unit shown in FIG. 2;

FIG. 4 is a planar structural schematic diagram of the first connectionsub-portion shown in FIG. 3;

FIG. 5 is a partial structural schematic diagram of a light-emittingsub-unit provided by another example of the embodiment of the presentdisclosure;

FIG. 6 is a partial planar structural schematic diagram of a backplaneprovided by another example of the embodiment of the present disclosure;

FIG. 7 is a planar structural schematic diagram of a light-emitting unitprovided by another example of the embodiment of the present disclosure;

FIG. 8 is a structural schematic diagram of a partial cross sectiontaken along line AA shown in FIG. 6;

FIG. 9 is a partial planar structural schematic diagram of a glass-basedcircuit board provided by another embodiment of the present disclosure;

FIG. 10 is a planar structural schematic diagram of a connection lineunit in the glass-based circuit board shown in FIG. 9;

FIG. 11 is a planar structural schematic diagram of a third connectionportion in the connection line sub-unit of FIG. 10; and

FIG. 12 is a partial planar structural schematic diagram of a connectionline sub-unit provided by another example of the embodiment of thepresent disclosure.

DETAILED DESCRIPTION

In order to make objects, technical details and advantages of theembodiments of the disclosure apparent, the technical solutions of theembodiments will be described in a clearly and fully understandable wayin connection with the drawings related to the embodiments of thedisclosure. Apparently, the described embodiments are just a part butnot all of the embodiments of the disclosure. Based on the describedembodiments herein, those skilled in the art can obtain otherembodiment(s), without any inventive work, which should be within thescope of the disclosure.

Unless otherwise defined, all the technical and scientific terms usedherein have the same meanings as commonly understood by one of ordinaryskill in the art to which the present disclosure belongs. The terms“first,” “second,” etc., which are used in the description and theclaims of the present application for disclosure, are not intended toindicate any sequence, amount or importance, but distinguish variouscomponents. Also, the terms such as “a,” “an,” etc., are not intended tolimit the amount, but indicate the existence of at least one. The terms“comprise,” “comprising,” “include,” “including,” etc., are intended tospecify that the elements or the objects stated before these termsencompass the elements or the objects and equivalents thereof listedafter these terms, but do not preclude the other elements or objects.

Embodiments of the present disclosure provide a backplane and aglass-based circuit board. The backplane comprises a base substrate anda plurality of light-emitting units arranged in an array on the basesubstrate. Each of the light-emitting units comprises a connection lineand a plurality of light-emitting diode chips connected with theconnection line; and the light-emitting diode chips are located on aside of the connection line away from the base substrate. Each of thelight-emitting units comprises at least one light-emitting sub-unit, andthe light-emitting diode chips in the light-emitting sub-unit areconnected in series. In the embodiment of the present disclosure, theconnection line unit is used to connect the light-emitting diode chipsin the light-emitting sub-unit in series, which can increase spaceutilization of the backplane and reduce driving costs.

Hereinafter, the backplane and the glass-based circuit board provided bythe embodiments of the present disclosure will be described inconjunction with the accompanying drawings.

FIG. 1 is a partial planar structural schematic diagram of a backplaneprovided by an embodiment of the present disclosure; and FIG. 2 is aplanar structural schematic diagram of the light-emitting unit in thebackplane shown in FIG. 1. As shown in FIG. 1 and FIG. 2, the backplanecomprises a base substrate 100 and a plurality of light-emitting units110 arranged in an array on the base substrate 100. Each of thelight-emitting units 110 comprises a connection line 200 and a pluralityof light-emitting diode chips 300 connected with the connection line200; and the light-emitting diode chips 300 are located on a side of theconnection line 200 away from the base substrate 100. Each of thelight-emitting units 110 comprises at least one light-emitting sub-unit101, and light-emitting diode chips 300 in the light-emitting sub-unit101 are connected in series. In the embodiment of the presentdisclosure, the connection line unit is used to connect thelight-emitting diode chips in the light-emitting sub-unit in series,which can increase space utilization of the backplane, improveefficiency, help maintain product consistency, and reduce driving costs.

For example, the light-emitting diode chips 300 can be microlight-emitting diode chips, and be arranged in an array on the basesubstrate 100. For example, a maximum size of the micro light-emittingdiode chip 300 in a direction parallel to the base substrate 100 is notgreater than 100 microns.

For example, the light-emitting diode chips 300 can also be minilight-emitting diode chips (mini LEDs), and be arranged in an array onthe base substrate 100. For example, a maximum size of the mini LED 300in the direction parallel to the base substrate 100 is not greater than500 microns. For example, a size of the mini LED 300 can be 0.2 mm×0.4mm.

For example, the backplane provided by the embodiment of the presentdisclosure can be used as a backlight source, or can also be used as adisplay panel, which will not be limited in the embodiment of thepresent disclosure.

In some examples, the base substrate 100 is a glass substrate.

In the study, an inventor of the present application finds that: asubstrate of a single PCB board is prone to a warpage problem, so, in aprocess of fabricating a large-sized backplane, a plurality of PCBboards are required be spliced, to ensure that an entire circuit boardcomprised in the backplane has relatively high flatness. However, thesplicing of the plurality of the PCB boards will increase fabricationand driving costs. In addition, poor heat dissipation performance of thesubstrate of the PCB board (of which a thermal diffusion coefficient is0.4 W/m·K) will cause the backplane to be prone to defects due to anexcessively high temperature during operation.

In one embodiment of the present disclosure, a glass substrate providedwith a circuit connection unit is used instead of a commonly usedsubstrate, for example, a PCB board for electrically connectinglight-emitting diode chips in a backlight source, which can overcome theproblem of poor heat dissipation performance of a general PCB substrate;in addition, because the glass substrate is not easily deformed, onlyone large-sized glass substrate is required to be used in a process offabricating a large-sized backplane, without splicing a plurality ofsubstrates, which can reduce fabrication costs and driving costs.

In some examples, as shown in FIG. 1 and FIG. 2, in each of thelight-emitting sub-units 101, a connection line 200 comprises a firstconnection portion 210 and a second connection portion 220; the firstconnection portion 210 comprises a first input end 211; and the secondconnection portion comprises a second input end 221. The connection line200 in each of the light-emitting sub-units 101 connects a plurality ofthe light-emitting diode chips 300 in series.

In some examples, as shown in FIG. 1 and FIG. 2, the first connectionportion 210 and the second connection portion 220 each comprise anelectrical contact point, for example, the first connection portion 210comprises a first electrical contact point 2021, and the secondconnection portion 220 comprises a second electrical contact point 2022.In each of the light-emitting sub-units 101, the connection line 200further comprises a third connection portion 230, and both ends of thethird connection portion 230 each comprise one electrical contact point,for example, both ends of the third connection portion 230 each comprisea third electrical contact point 2023. The third electrical contactpoint 2023 at one end of the third connection portion 230 and the firstelectrical contact point 2021 of the first connection portion 210constitute an electrical contact point pair 202; the third electricalcontact point 2023 at the other end of the third connection portion 230and the second electrical contact point 2022 of the second connectionportion 220 constitute an electrical contact point pair 202; and each ofthe electrical contact point pairs 202 is respectively connected with ananode 310 and a cathode 320 of the light-emitting diode chip 300 inone-to-one correspondence.

For example, as shown in FIG. 1 and FIG. 2, each of the light-emittingsub-units 101 comprises a first connection portion 210, a secondconnection portion 220, a third connection portion 230, and a pluralityof light-emitting diode chips 300, that is, the light-emitting sub-unithas a connection from a first input end 211 of the first connectionportion 210, by the light-emitting diode chips 300 and the thirdconnection portion 230, to a second input end 221 of the secondconnection portion 220, so that the light-emitting diode chips 300 ofthe light-emitting sub-unit 110 are connected in series.

For example, as shown in FIG. 1 and FIG. 2, the first connection portion210, the second connection portion 220 and the third connection portion230 are provided in a same layer and made of a same material. The “samelayer” here and later refers to a relationship between a plurality offilm layers formed of a same material after a same step (e.g., aone-step patterning process). For example, a metal layer can bedeposited firstly, and then the metal layer is patterned to form therespective connection portions. The “same layer” here does not alwaysrefer to that thicknesses of the plurality of the film layers are equalor heights of the plurality of the film layers in a cross-sectional vieware equal.

For example, materials of the respective connection portions can all becopper, but are not limited thereto, and can also be other conductivematerials.

For example, an insulation layer (a first insulation layer 700 shown inFIG. 8) is provided between the light-emitting diode chips 300 and theconnection line 200, and the anodes 310 and the cathodes 320 of thelight-emitting diode chips 300 can respectively connected with theelectrical contact points of the connection line 200 correspondinglythrough via holes located in the insulation layer, so that theconnection line 200 functions to electrically connect the light-emittingdiode chips 300. The electrical contact points on the respectiveconnection portions refer to the electrical connection points where theanodes or the cathodes of the light-emitting diode chips 300 areconnected to the connection portions through via holes. For example, theelectrical contact point can be a portion of the connection portionwhich is used for electrical connecting with the anode or the cathode ofthe light-emitting diode chip 300, for example, the electrical contactpoint 2021 on the first connection portion 210 shown in FIG. 8 later.

In some examples, as shown in FIG. 1 and FIG. 2, the two connectionportions constituting the electrical contact point pair have a spacetherebetween, and an orthogonal projection of the light-emitting diodechip 300 on the base substrate 100 at least partially overlaps with anorthogonal projection of the space on the base substrate 100. Forexample, orthogonal projections of the anode 310 and the cathode 320 ofthe light-emitting diode chip 300 on the base substrate 100 can belocated within an orthogonal projection of the connection portion on thebase substrate 100, but are not limited thereto, provided the anode andthe cathode of the light-emitting diode chip are respectivelyelectrically connected to adjacent connection portions.

For example, in a film layer where the respective connection portionsare located, there is no connection between the adjacent connectionportions, and the light-emitting diode chip electrically connected withthe adjacent connection portions connects the adjacent connectionportions. That is to say, in the film layer where the respectiveconnection portions are located, the adjacent connection portions arespaced apart from each other. For example, a space between the adjacentconnection portions can be filled with an insulation material.

In some examples, as shown in FIG. 1 and FIG. 2, in each of thelight-emitting sub-units 101, the third connection portion 230 comprisesa plurality of connection sub-portions 231; and both ends of each of theconnection sub-portions 231 each comprise one electrical contact point,for example, a third electrical contact point 2023, for electricalconnecting with the anode 310 or the cathode 320 of the light-emittingdiode chip 300. The third electrical contact points 2023 at adjacentends of the adjacent connection sub-portions 231 constitute anelectrical contact point pair 203; two electrical contact points in eachof the electrical contact point pairs 203 are respectively connectedwith the anode 310 and the cathode 320 of the light-emitting diode chip300 in one-to-one correspondence; and the plurality of the connectionsub-portions 231 are connected head to tail by the light-emitting diodechips 300, that is, the plurality of the connection sub-portions 231 areconnected in series. The above-described expression “adjacent ends ofthe adjacent connection sub-portions” refers to that closely adjacentportions of the adjacent connection sub-portions are respectively endportions of the two connection sub-portions. The above-describedexpression that “the plurality of the connection sub-portions areconnected head to tail by the light-emitting diode chips” refers to thata head end of one connection sub-portion is connected to a tail end ofanother connection sub-portion by the light-emitting diode chip; and theplurality of the connection sub-portions are connected sequentially.

It should be noted that, in order to clearly illustrate the electricalcontact points on the connection portion, a part of the light-emittingdiode chips in FIG. 2 are not shown.

FIG. 3 is a schematic diagram of a third connection portion in theconnection line in the light-emitting sub-unit in FIG. 2, and FIG. 4 isa schematic diagram of the first connection sub-portion in FIG. 3. Inorder to clearly illustrate a position relationship between theelectrical contact points on the connection sub-portions and theadjacent connection sub-portions, FIG. 3 shows a part of thelight-emitting diode chips.

In some examples, as shown in FIG. 1 to FIG. 4, the plurality of theconnection sub-portions 231 comprise first connection sub-portions 2311and second connection sub-portions 2312. The plurality of the connectionsub-portions 231 can be divided into a plurality of the first connectionsub-portions 2311 and a plurality of the second connection sub-portions2312. That is to say, a certain connection sub-portion 231 can be thefirst connection sub-portion 2311, or a certain connection sub-portion231 can be the second connection sub-portion 2312. The first connectionsub-portion 2311 extends along a first direction (i.e., an X direction)parallel to the base substrate 100. The first connection sub-portion2311 has an irregular shape, in which notches 2313 are formed at twocorners of a substantially rectangular shape (dashed frames shown inFIG. 4) that are opposite to each other in a diagonal direction. Forexample, the first connection sub-portion 2311 has a shape obtained bycutting off the two rectangular corners opposite to each other in thediagonal direction. The above-described expression “substantiallyrectangular shape” refers to that a shape constituted by the firstconnection sub-portion and the notches can be a standard right-angledrectangle, or can also be an approximate rectangle such as a roundedrectangle.

For example, as shown in FIG. 1 to FIG. 4, a shape of the notch 2313 canbe a rectangle, but is not limited thereto.

In some examples, as shown in FIG. 1 to FIG. 4, the first connectionsub-portion 2311 comprises connection regions 2314 (regions shown bydashed lines) corresponding to the notches 2313; and an electricalcontact point 2023 of the first connection sub-portion 2311 is locatedon a side of the connection region 2314 facing the notch 2313. Theabove-described expression “connection regions corresponding to thenotches” refers to portions of the first connection sub-portion 2311which are adjacent to the notches 2313 in the Y direction. Theconnection regions 2314 are just two corners reserved at twosubstantially rectangular corners opposite to each other in the diagonaldirection, that is, the two opposite corners of the above-describedrectangle that are not cut off. The electrical contact points 2023 arelocated in positions of the connection regions 2314 which are close tothe notches 2313 adjacent thereto.

For example, as shown in FIG. 1 to FIG. 4, a plurality of thelight-emitting diode chips 300 in each of the light-emitting unit 110have a same orientation from the anode 310 to the cathode 320.

For example, the orientation from the cathode 320 to the anode 310 ofeach of the light-emitting diode chip 300 is a direction indicated by anarrow of the Y direction in FIG. 1 to FIG. 4, then, in order that thelight-emitting diode chips 300 located in the light-emitting sub-unit101 among the whole light-emitting diode chips 300 arranged in an arrayare connected in series, one of the two connection regions 2314 of thefirst connection sub-portion 2311 is required to be connected with ananode 310 of one light-emitting diode chip 300, and the other connectionregion 2314 is required to be connected with a cathode 320 of anotherlight-emitting diode chip 300. Thus, the two connection regions 2314 ofthe first connection sub-portion 2311 are respectively located on bothsides of the first connection sub-portion 2311 in the Y direction and atboth ends of the first connection sub-portion 2311 in the X direction.

For example, as shown in FIG. 1 to FIG. 4, a size of a portion of thefirst connection sub-portion 2311 other than the connection regions 2314at respective positions is equal in the Y direction. For example, theportion of the first connection sub-portion 2311 other than theconnection regions 2314 can be a rectangle.

For example, as shown in FIG. 1 to FIG. 4, the first connectionsub-portion 2311 can comprise a rectangular central portion as well as afirst edge portion and a second edge portion respectively located onboth sides of a first central line of the rectangular central portionthat extends along the Y direction. Along the Y direction, sizes of thefirst edge portion and the second edge portion are both smaller than asize of the central portion; and edges of the first edge portion and thesecond edge portion that are away from a second central line of thecentral portion that extends along the X direction are aligned withedges of the central portion that extend along the X direction. Here,the first edge portion and the second edge portion are just theconnection regions 2314 in FIG. 4, and the central portion is theportion of the first connection sub-portion other than the connectionregions.

In some examples, as shown in FIG. 1 to FIG. 4, the second connectionsub-portion 2312 extends along the second direction (the Y direction)parallel to the base substrate 100 and intersecting with the firstdirection (the X direction); the electrical contact points 2023 of thesecond connection sub-portion 2312 are located at both end portions ofthe second connection sub-portion 2312 in the second direction. Theelectrical contact point pair 203 constituted by the electrical contactpoint 2023 of the second connection sub-portion 2312 and the electricalcontact point 2023 of an adjacent first connection sub-portion 2311 isconfigured to connect the plurality of the light-emitting diode chips300 in series.

In some examples, as shown in FIG. 1 to FIG. 4, the light-emittingsub-unit 101 comprises a plurality of first connection sub-portion rows2310 extending along the first direction and arranged in the seconddirection; each of the first connection sub-portion rows 2310 comprisesat least one first connection sub-portion 2311. FIG. 3 schematicallyshows that the first connection sub-portion row 2310 comprises one firstconnection sub-portion 2311. Two end portions of the second connectionsub-portion 2312 are respectively located in notches 2313 opposite toeach other at end portions of adjacent two first connection sub-portionrows 2310, so as to connect the adjacent first connection sub-portionrows 2310 by the light-emitting diode chips 300. That is, an end portionof the second connection sub-portion 2312 extends into the notch 2313 ofthe first connection sub-portion 2311, so that the third electricalcontact point 2023 located at the end portion of the second connectionsub-portion 2312 can constitute the electrical contact point pair 203with the third electrical contact point 2023 located in the connectionregion 2314 of the first connection sub-portion 2311.

In some examples, as shown in FIG. 1 to FIG. 4, the second connectionsub-portions 2312 connected with a same first connection sub-portion row2310 by the light-emitting diode chips 300 are respectively located onboth sides of the first connection sub-portion row 2310 in the seconddirection and are respectively located at both ends of the firstconnection sub-portion row 2310 in the first direction. An example inwhich one first connection sub-portion row 2310 comprises one firstconnection sub-portion 2311 is illustrated. Because two notches 2313 ofthe first connection sub-portion 2311 are respectively located on bothsides of the first connection sub-portion 2311 in the Y direction andlocated at both ends of the first connection sub-portion 2311 in the Xdirection, the two second connection sub-portions 2312 connected withthe first connection sub-portion 2311 by the light-emitting diode chips300 are respectively located on both sides of the first connectionsub-portion 2311 in the Y direction and located at both ends of theconnection sub-portion 2311 in the X direction.

FIG. 5 is a partial structural schematic diagram of a light-emittingsub-unit comprised in a backplane provided by another example of theembodiment of the present disclosure. As shown in FIG. 5, each of thefirst connection sub-portion rows 2310 can comprise a plurality of thefirst connection sub-portions 2311; and a connection region 2314 of onefirst connection sub-portion 2311 of adjacent first connectionsub-portions 2311 is located in a notch 2313 of the other firstconnection sub-portion 2311 of the adjacent first connectionsub-portions 2311, so that adjacent connection regions 2314 areconnected by the light-emitting diode chip 300. For example, theexpression that adjacent connection regions are connected by thelight-emitting diode chip can be that the adjacent connection regionsare electrically connected by the light-emitting diode chip. Aconnection region 2314 of one first connection sub-portion 2311 of theadjacent first connection sub-portions 2311 extends into a notch 2313 ofthe other first connection sub-portion 2311 of the adjacent firstconnection sub-portions 2311, so that electrical contact points on thetwo connection regions 2314 adjacent to each other of the two firstconnection sub-portions 2311 are respectively electrically connectedwith an anode and a cathode of the light-emitting diode chip 300. Thatis, the adjacent first connection sub-portions 2311 in the firstconnection sub-portion row 2310 have complementary shapes in a positionwhere the connection is implemented by the light-emitting diode chip300.

In some examples, as shown in FIG. 3 to FIG. 5, each of the firstconnection sub-portion rows 2310 comprises a first end portion 2315 anda second end portion 2316; first end portions 2315 of the plurality ofthe connection sub-portion rows 2310 are aligned in the seconddirection; the second end portions 2316 of the plurality of theconnection sub-portion rows 2310 are aligned in the second direction;and the plurality of the first connection sub-portion rows 2310 and thesecond connection sub-portions 2312 are integrally connected in a squarewave shape to efficiently utilize the space of the backplane.

For example, as shown in FIG. 3 to FIG. 5, an edge of the secondconnection sub-portion 2312 away from the first connection sub-portion2310 and extending along the Y direction is aligned with the first endportion 2315 or the second end portion 2316 of the first connectionsub-portion row 2310.

In some examples, as shown in FIG. 3 to FIG. 5, except the connectionregions 2314 located at both ends of the first connection sub-portionrow 2310, a size D of the first connection sub-portion row 2310 atrespective positions in the first direction is substantially equal inthe second direction. The expression “substantially equal” here andlater refers to that, a ratio of a size difference at respectivepositions along the second direction to a size at the respectivepositions is not greater than 5%. When the first connection sub-portionrow 2310 comprises a plurality of the first connection sub-portions2311, along the Y direction, a total size of two connection regions 2314forming the electrical contact point pair 203 in adjacent firstconnection sub-portions 2311 and a space between the two connectionregions 2314 is equal to a size of a portion of a first connectionsub-portion 2311 other than the connection regions 2314, to efficientlyutilize the space of the backplane.

In some examples, as shown in FIG. 1 to FIG. 2, at least onelight-emitting unit 110 comprises a plurality of light-emittingsub-units 101; and the plurality of the light-emitting sub-units 101share the first connection portion 210 and the second connection portion220, so as to be connected in parallel, that is, the plurality of thelight-emitting sub-units 101 share the first connection portion 210 andthe second connection portion 220, so that the plurality of thelight-emitting sub-units 101 are connected in parallel. FIG. 1schematically shows that two light-emitting units 110 adjacent in thefirst direction have first connection portions and the second connectionportions both separated from each other, but it is not limited thereto.In order to reduce the number of wirings connecting the cathodes of thelight-emitting diode chips to the circuit board (e.g., a printed circuitboard), second connection portions (an example in which the secondconnection portions are connected with the cathodes of thelight-emitting diode chips is illustrated) of at least twolight-emitting units arranged in the first direction can also beelectrically connected. Similarly, the second connection portions of atleast two light-emitting units arranged in the second direction can beconnected to a same cathode wiring to save the number of the wirings andreduce the fabrication process costs.

For example, in one example of the embodiment of the present disclosure,a plurality of the light-emitting sub-units 101 in each of thelight-emitting units 110 are connected in parallel; and a plurality ofthe light-emitting diode chips 300 in each of the light-emittingsub-units 101 are connected in series.

FIG. 6 is a partial planar structural schematic diagram of a backplaneprovided by another example of the embodiment of the present disclosure.As shown in FIG. 6, the backplane in the example differs from thebackplane shown in FIG. 1 in that: each of the light-emitting units 110in the example comprises only one light-emitting sub-unit, then, aplurality of light-emitting diode chips 300 in the light-emitting unit110 are connected in series by a first connection portion 210, a secondconnection portion 220, and a third connection portion 230 comprised inthe connection line 200. FIG. 6 schematically shows that secondconnection portions of adjacent two light-emitting units 110 arranged inthe second direction are connected to different cathode wirings, but itis not limited thereto. In order to reduce the number of the wirings forconnecting the cathodes of the light-emitting diode chips to the circuitboard (e.g., a printed circuit board), the second connection portions ofat least two light-emitting units arranged in the second direction canalso be connected to a same cathode wiring, so as to save the number ofthe wirings and reduce the fabrication process costs.

In the embodiment of the present disclosure, a glass substrate providedwith a circuit connection unit, for example, a PCB board forelectrically connecting light-emitting diode chips in a backlightsource, is used instead of a conventional substrate, and a purpose forfabricating more light regions on only one glass substrate can beachieved without splicing a plurality of substrates, which saves costs.

As shown in FIG. 1 to FIG. 2, the first connection portion 210 comprisesa first protrusion portion 212; and the first protrusion portion 212 islocated within a notch 2313 at a connection region 2314 of a firstconnection sub-portion row 2310 connected with the first protrusionportion 212 by the light-emitting diode chip 300. A first electricalcontact point 2021 of the first connection portion 210 is located in thefirst protrusion portion 212; and the first protrusion portion 212extends into the notch 2313 of the first connection sub-portion row2310, so that the first electrical contact point 2021 of the firstconnection portion 210 and a third electrical contact point 2023 of athird connection portion 230 are respectively electrically connectedwith an anode 310 and a cathode 320 of the light-emitting diode chip300. For example, the first protrusion portion 212 and the correspondingnotch 2313 of the first connection sub-portion row have complementaryshapes.

In some examples, as shown in FIG. 1 to FIG. 2, the second connectionportion 220 comprises a second protrusion portion 222; and the secondprotrusion portion 222 is located within a notch 2313 at a connectionregion 2314 of the first connection sub-portion row 2310 connected withthe second protrusion portion 222 by the light-emitting diode chip 300.A second electrical contact point 2022 of the second connection portion220 is located in the second protrusion portion 222; and the secondprotrusion portion 222 extends into the notch 2313 of the firstconnection sub-portion row 2310, so that the second electrical contactpoint 2022 of the second connection portion 220 and a third electricalcontact point 2023 of the third connection portion 230 are respectivelyelectrically connected with an anode 310 and a cathode 320 of thelight-emitting diode chip 300. For example, the second protrusionportion 222 and the corresponding notch 2313 of the first connectionsub-portion row have complementary shapes.

FIG. 7 is a planar structural schematic diagram of a light-emitting unitprovided by another example of the embodiment of the present disclosure.As shown in FIG. 7, a difference from the example shown in FIG. 1 isthat, a third connection portion 230 in the example comprises only oneconnection sub-portion; both ends of the third connection portion 230each are provided with a third electrical contact point 2023; inaddition, the third electrical contact point 2023 at one end of thethird connection portion 230 and a first electrical contact point 2021at an end portion of a first connection portion 210 constitute anelectrical contact point pair, and the third electrical contact point2023 at the other end of the third connection portion 230 and a secondelectrical contact point 2022 of the second connection portion 220constitute an electrical contact point pair. Thus, in the example, eachof the light-emitting sub-units 101 comprises only two light-emittingdiode chips 300 connected in series; and a plurality of light-emittingsub-units 101 comprised in the light-emitting unit 110 are connected inparallel by the first connection portion 210 and the second connectionportion 220.

The example is not limited thereto. For example, the light-emitting unit110 can further comprise more than three light-emitting sub-units 101;and the third connection portion 230 in the respective light-emittingsub-units 101 comprises only one connection sub-portion. For example,the third connection portion 230 in the respective light-emittingsub-units 101 comprised in the light-emitting unit 110 can also comprisea plurality of connection sub-portions; each of the connectionsub-portions extends along the Y direction; both ends of the connectionsub-portions in the Y direction respectively have an electrical contactpoint; and adjacent connection sub-portions are connected by thelight-emitting diode chip 300, that is, the adjacent connectionsub-portions are connected head to tail by the light-emitting diode chip300.

In some examples, as shown in FIG. 1 to FIG. 7, a plurality oflight-emitting diode chips 300 in each of the light-emitting units 110are evenly distributed.

For example, as shown in FIG. 1 to FIG. 7, in a case in which aplurality of light-emitting units are arranged in an array, theplurality of the light-emitting diode chips 300 in the backplane canalso be evenly distributed. For example, a minimum distance between twolight-emitting diode chips 300 adjacent to each other in the firstdirection is a first distance; and a minimum distance between twolight-emitting diode chips 300 adjacent to each other in the seconddirection is a second distance. For example, according to the embodimentof the present disclosure, the first distances of the respectivepositions are all equal to each other, or the second distances of therespective positions are all equal to each other; or the first distancesof the respective positions are all equal to each other, and the seconddistances of the respective positions are all equal to each other.

For example, the positions and connection relationship of the respectiveconnection portions in the connection line 200 on the base substrate 100are designed according to the positions of the light-emitting diodechips 300. In the embodiment of the present disclosure, in order toimplement better current carrying capacity of the respective connectionportions; a line width of each of the connection portions in a directionperpendicular to an extension direction of the each of the connectionportions should be set greater; however, a distance between adjacentconnection portions can be made not less than 15 microns whileincreasing the line width as wide as possible. For example, therespective connection portions are spread all over the glass substratein a case in which the distance between the respective connectionportions is not less than 15 microns, which can improve flatness of theentire backplane before providing the light-emitting diode chips.

FIG. 8 is a structural schematic diagram of a partial cross sectiontaken along line AA shown in FIG. 6. As shown in FIG. 6 and FIG. 8, thebackplane further comprises a plurality of wirings 500 parallel to eachother; the wirings 500 are located on a side of the connection line 200facing the base substrate 100, and comprise a plurality of first wirings510 and a plurality of second wirings 520. The wirings 500, for example,extend along the second direction.

For example, as shown in FIG. 6 and FIG. 8, in the embodiment of thepresent disclosure, the plurality of the first wirings 510 and theplurality of the second wirings 520 extending along the second directioncan be formed by depositing a first conductive layer on the basesubstrate 100 and patterning the first conductive layer. For example,the first conductive layer can be directly deposited on the glasssubstrate.

For example, as shown in FIG. 6 and FIG. 8, a first insulation layer 600is provided between the plurality of the wirings 500 parallel to eachother and the connection line 200, to have an insulation function. Forexample, a thickness of the first insulation layer 600 is relativelythin, which can be on an order of microns. The first insulation layer600 can comprise a first buffer layer 610, a first resin layer 620, anda first passivation layer 630; and the first resin layer 620 can serveto adhere the first buffer layer 610 and the first passivation layer630.

For example, after patterning to form the wiring 500, a first insulationmaterial layer can be deposited on the wiring 500, and the firstinsulation material layer is patterned to form a via hole exposing thefirst wiring 510 and a via hole exposing the second wiring 520. FIG. 8schematically shows the via hole exposing the first wiring 510.

For example, if a material of the wiring 500 comprises copper, amaterial of the first buffer layer 610 in the first insulation layer 600that is in contact with the wiring 500 comprises silicon nitride, whichresults in better adhesion between the wiring 500 and the first bufferlayer 610.

For example, after patterning to form the first insulation layer 600, asecond conductive layer can be deposited on the first insulation layer600, and the second conductive layer is patterned to form the connectionline 200 in the respective light-emitting units.

For example, if a material of the connection line 200 comprises copper,a material of the first passivation layer 630 in the first insulationlayer 600 that is in contact with the connection line 200 comprisessilicon nitride, which results in better adhesion between the connectionline 200 and the first passivation layer 630.

For example, as shown in FIG. 6 and FIG. 8, the first input end 211 ofthe connection line 200 is connected with the first wiring 510, and thesecond input end 221 of the connection line 200 is connected with thesecond wiring 520. That is, the first input end 211 of the firstconnection portion 210 is electrically connected with the first wiring510 through the via hole 601 located in the first insulation layer 600,to connect one of the anode and the cathode of the light-emitting diodechip 300 that is electrically connected with the first electricalcontact point of the first connection portion 210 to the first wiring510; the second input end 221 of the second connection portion 220 iselectrically connected with the second wiring 520 through the via holelocated in the first insulation layer 600, to connect the other of theanode and the cathode of the light-emitting diode chip 300 that iselectrically connected with the second electrical contact point of thesecond connection portion 220 to the second wiring 520.

For example, the base substrate 100 is a glass substrate, and athickness of the base substrate 100 can be approximately 5 millimeters.Because thicknesses of the respective conductive layers and insulationlayers can all be formed relatively thin, a thickness of the glass-basedcircuit board comprising the connection line in the backplane other thanthe light-emitting diode chips is not greater than 8 millimeters in thedirection perpendicular to the base substrate 100, so that an overallthickness of the backplane to be relatively thin can be ensured.

For example, as shown in FIG. 6, the backplane further comprises acircuit board 900 located on the base substrate 100; and the circuitboard 900 is configured to be electrically connected with the firstwiring 510 and the second wiring 520.

For example, the circuit board 900 can be a flexible printed circuitboard, which is connected with an external power source to performvoltage signal driving on the respective light-emitting units, forexample, in region division and/or time division.

For example, the external power source can comprise a 12 V voltagesource and a Serial Peripheral Interface (SPI).

For example, the external power source can be connected to the circuitboard 900 by a plurality of circuit controllers to implement controllingof the plurality of the light-emitting units in region division. Forexample, the respective circuit controllers can be connected by signallines such as power lines, clock lines, and input/output lines (I/Olines) to control operation timing of the respective circuitcontrollers; and each of the circuit controllers can be electricallyconnected with one or more light-emitting units to control thelight-emitting units to emit light in time division.

In the embodiment of the present disclosure, the backplane can achieveeffects of good contrast and high brightness by controlling thelight-emitting units in region division.

In some examples, as shown in FIG. 6 and FIG. 8, a thickness of thewiring 500 (e.g., less than 0.1 millimeters) is greater than a thicknessof the connection line 200, and widths of the first connection portion210, the second connection portion 220, and the third connection portion230 comprised in the connection line 200 are all greater than a width ofthe wiring 500. The plurality of the wirings 500 parallel to each otherare distributed on the base substrate 100 to connect the anodes and thecathodes of light-emitting diode chips 300 in the respectivelight-emitting units to the circuit board 900; and in a case in which adistance between adjacent wirings 500 is ensured to meet electricalsafety requirements (e.g., not less than 15 microns), the line width ofthe wiring 500 can be set relatively narrow, so that the number of thelight-emitting units can be more. Meanwhile, in order to ensure currentcarrying capacity of the wiring 500, the thickness of the wiring 500 canbe set relatively great. For example, line widths of the wirings and therespective connection portions can be obtained according to temperatureincreasement of materials thereof, that is, a line width can be obtainedaccording to relationship between temperature increasement of a materialand a load current. Because the insulation layer located between thewiring and the connection line is relatively thin, when designing theline width of the connection portion in the connection line, it shouldalso be considered to avoid signal crosstalk due to a relatively largeoverlapping area of the wiring and the connection line.

For example, as shown in FIG. 8, the backplane further comprises areflective layer 400 located between the connection line 200 and theplurality of the light-emitting diode chips 300. A second insulationlayer 700 is further provided between the reflective layer 400 and theconnection line 200 to isolate the reflective layer 400 and theconnection line 200 from each other.

For example, the reflective layer 400 can be a metal layer having asmooth surface to reflect light. The reflective layer according to theembodiment of the present disclosure is used to reflect light emitted bythe light-emitting diode chip, so as to improve light efficiency. Ascompared with a method of providing photosensitive white oil on ageneral PCB board to reflect light, the method of providing thereflective layer according to the embodiment of the present disclosurecan achieve better light reflecting effect, and improve lightefficiency.

For example, as shown in FIG. 8, the second insulation layer 700comprises a second buffer layer 710 and a second resin layer 720.

For example, a material of the connection line 200 comprises copper, anda material of the second buffer layer 710 in the second insulation layer700 that is in contact with the connection line 200 comprises siliconnitride, which results in better adhesion between the connection line200 and the second buffer layer 710.

For example, after forming the connection line 200, a second insulationmaterial layer can be deposited on the connection line 200; the secondinsulation material layer is patterned to form the second insulationlayer 700 having a via hole; and the via hole in the second insulationlayer 700 is used to expose the connection line 200.

For example, after forming the second insulation layer 700, a reflectivematerial layer is deposited on the second insulation layer 700, and thereflective material layer is patterned to form the reflective layer 400exposing the connection line 200. That is, the reflective layer 400exposes the via hole provided in the second insulation layer 700 toensure that the subsequent light-emitting diode chip can be electricallyconnected with the connection line 200 through the via hole provided inthe second insulation layer 700.

For example, a third insulation layer 730 is further provided on a sideof the reflective layer 400 away from the second insulation layer 700 toinsulate the reflective layer 400 from the light-emitting diode chip300.

In some examples, as shown in FIG. 8, the backplane further comprises awhite glue layer 810 located on a side of the reflective layer 400 awayfrom the base substrate 100; and the white glue layer 810 has an openingexposing the light-emitting diode chip 300.

For example, after electrical connection between the light-emittingdiode chip 300 and the connection line 200 is completed, the white gluelayer 810 can be formed. For example, before forming the white gluelayer 810, a surface in a position surrounding the light-emitting diodechip 300 and closely adjacent to the light-emitting diode chip 300 and aposition outside the region can be subjected to a treatment, forexample, respectively subjected to hydrophobization andhydrophilization, so that the white glue layer 810 sprayed betweenadjacent light-emitting diode chips 300 does not cover thelight-emitting diode chip 300 during a diffusion process. For example,the white glue layer 810 and the light-emitting diode chip 300 are bothprovided on a same layer. For example, as shown in FIG. 8, the whiteglue layer 810 and the light-emitting diode chip 300 are both located onthe third insulation layer 730.

For example, as shown in FIG. 8, the region surrounding thelight-emitting diode chip 300 can expose the reflective layer 400, sothat the reflective layer 400 reflects light emitted by thelight-emitting diode chip 300, so as to improve light efficiency. Athickness of the white glue layer 810 located between light-emittingdiode chips 300 is relatively great so that a distance between a flatsurface of the white glue layer 810 away from the base substrate 100 andthe base substrate 100 is greater than a distance between a surface ofthe light-emitting diode chip 300 away from the base substrate 100 andthe base substrate 100, and thus, the white glue layer surrounding thelight-emitting diode chip can also have a function of reflecting lightto further increase reflectivity of the backplane.

For example, as shown in FIG. 8, the backplane further comprises atransparent layer 820 located on a side of the white glue layer 810 awayfrom the base substrate 100 to cover the white glue layer 810 and thelight-emitting diode chip 300, thereby protecting the light-emittingdiode chip 300.

For example, as shown in FIG. 6 and FIG. 8, the base substrate 100 cancomprise a plurality of coating regions extending along the seconddirection and closely arranged in the first direction; and coating canbe completed by sequentially coating the transparent layer 820 in eachcoating region.

Another embodiment of the present disclosure provides a glass-basedcircuit board, FIG. 9 is a planar structural schematic diagram of aglass-based circuit board provided by another embodiment of the presentdisclosure; and FIG. 10 is a planar structural schematic diagram of theconnection line unit in the glass-based circuit board shown in FIG. 9.As shown in FIG. 9 to FIG. 10, the glass-based circuit board comprises aglass substrate 10 and a plurality of connection line units 200 arrangedin an array on the glass substrate 10. Each of the connection line units200 comprises at least one connection line sub-unit 201; the connectionline sub-unit 201 comprises a plurality of electrical contact pointpairs; each of the electrical contact point pairs is configured to beconnected with an anode and a cathode of a light-emitting diode chip inone-to-one correspondence. The connection line sub-unit 201 shown inFIG. 9 comprises connection portions that connect the plurality of thelight-emitting diode chips in the light-emitting sub-unit shown in FIG.1 in series. The glass-based circuit board provided by this embodimentcan be a circuit board of the backplane shown in FIG. 1 before providingthe light-emitting diode chip.

The glass-based circuit board according to the embodiment of the presentdisclosure replaces a general PCB board, for example, a PCB board usedfor electrically connecting the light-emitting diode chips in abacklight source, which can overcome the problem of poor heatdissipation performance of a general PCB substrate; in addition, becausethe glass substrate is not easily deformed, only one large-sized glasssubstrate is required to be used in a process of fabricating alarge-sized backplane, without splicing a plurality of substrates, whichcan reduce fabrication costs and driving costs.

In some examples, as shown in FIG. 9 and FIG. 10, the connection linesub-unit 201 comprises a first connection portion 210 and a secondconnection portion 220; the first connection portion 210 comprises afirst input end 211; the second connection portion comprises a secondinput end 221; and the first connection portion 210 and the secondconnection portion 220 respectively comprise an electrical contactpoint. For example, the first connection portion 210 comprises a firstelectrical contact point 2021; and the second connection portion 220comprises a second electrical contact point 2022. Referring to FIG. 9 toFIG. 10 and FIG. 1 to FIG. 2, the connection line sub-unit 201 isconfigured to connect a plurality of light-emitting diode chips 300 inseries.

In some examples, as shown in FIG. 9 and FIG. 10, the connection linesub-unit 201 further comprises a third connection portion 230; and bothends of the third connection portion 230 each comprise one electricalcontact point, for example, both ends of the third connection portion230 each comprise a third electrical contact point 2023. A thirdelectrical contact point 2023 at one end of the third connection portion230 and the first electrical contact point 2021 of the first connectionportion 210 constitute an electrical contact point pair 202; a thirdelectrical contact point 2023 at the other end of the third connectionportion 230 and the second electrical contact point 2022 of the secondconnection portion 220 constitute an electrical contact point pair 202.Referring to FIG. 9 to FIG. 10 and FIG. 1 to FIG. 2, each of theelectrical contact point pairs 202 can be respectively connected with ananode 310 and a cathode 320 of a light-emitting diode chip 300 inone-to-one correspondence.

For example, as shown in FIG. 9 to FIG. 10, the first connection portion210, the second connection portion 220 and the third connection portion230 are provided in a same layer and made of a same material. Forexample, materials of the respective connection portions can all becopper, but are not limited thereto, and can also be other conductivematerials.

In some examples, as shown in FIG. 9 and FIG. 10, in each of theconnection line sub-units 201, a third connection portion 230 comprisesa plurality of connection sub-portions 231; and both ends of each of theconnection sub-portions 231 each comprise one electrical contact point,for example, a third electrical contact point 2023. The plurality of theconnection sub-portions 231 are adjacent head to tail, so that adjacentelectrical contact points 2023 of adjacent connection sub-portions 231constitute an electrical contact point pair 203. The above-describedexpression that “the plurality of the connection sub-portions areadjacent head to tail” refers to that the plurality of the connectionsub-portions each comprise a first end and a second end; a first end ofone connection sub-portion of two adjacent connection sub-portions isadjacent to a second end of the other connection sub-portion of the twoadjacent connection sub-portions; and an electrical contact pointlocated at a first end of the one connection sub-portion and anelectrical contact point located at a second end of the other connectionsub-portion constitute an electrical contact point pair.

Referring to FIG. 9 to FIG. 10 and FIG. 1 to FIG. 2, both ends of eachof the connection sub-portions 231 each comprise a third electricalcontact point 2023 for electrical connecting with an anode 310 or acathode 320 of a light-emitting diode chip 300; two electrical contactpoints in each of the electrical contact point pairs 203 can berespectively connected with an anode 310 and a cathode 320 of onelight-emitting diode chip 300 in one-to-one correspondence, so that theplurality of the connection sub-portions 231 are connected head to tailby the light-emitting diode chips 300. That is, the plurality of theconnection sub-portions 231 are connected head to tail sequentially bythe light-emitting diode chips 300.

FIG. 11 is a schematic diagram of the third connection portion in theconnection line sub-unit of FIG. 10; and FIG. 4 is a schematic diagramof the first connection sub-portion in FIG. 11.

In some examples, as shown in FIG. 9 to FIG. 11 and FIG. 4, theplurality of the connection sub-portions 231 comprise a first connectionsub-portion 2311 and a second connection sub-portion 2312. The firstconnection sub-portion 2311 extends along a first direction (an Xdirection) parallel to the glass substrate 10; the first connectionsub-portion 2311 has a shape in which notches 2313 are formed at twocorners of a substantially rectangular shape that are opposite to eachother in a diagonal direction; the first connection sub-portion 2311comprises connection regions 2314 corresponding to the notches 2313; andan electrical contact point 2023 of the first connection sub-portion2311 is located on a side of the connection region 2314 facing the notch2313. The first connection sub-portion according to this embodiment hassame features as the first connection sub-portion shown in FIG. 3 toFIG. 4, which will be omitted here.

In some examples, as shown in FIG. 9 to FIG. 11, the second connectionsub-portion 2312 extends along a second direction (a Y direction)parallel to the glass substrate 100 and intersecting with the firstdirection; the electrical contact points 2023 of the second connectionsub-portion 2312 are located at both end portions of the secondconnection sub-portion 2312 in the second direction. An electricalcontact point pair 203 constituted by an electrical contact point 2023of the second connection sub-portion 2312 and an electrical contactpoint 2023 of an adjacent first connection sub-portion 2311 isconfigured to connect a plurality of the light-emitting diode chips 300shown in FIG. 1 in series. The second connection sub-portion accordingto this embodiment has same features as the second connectionsub-portion shown in FIG. 3 to FIG. 4, which will be omitted here.

In some examples, as shown in FIG. 9 to FIG. 11, the connection linesub-unit 201 comprises a plurality of first connection sub-portion rows2310 extending along the first direction and arranged in the seconddirection; each of the first connection sub-portion rows 2310 comprisesat least one first connection sub-portion 2311. FIG. 11 schematicallyshows that the first connection sub-portion row 2310 comprises one firstconnection sub-portion 2311. Two end portions of the second connectionsub-portion 2312 are respectively located in the notches 2313 at endportions of adjacent first connection sub-portion rows 2310, so thatelectrical contact points 2023 at the two end portions of the secondconnection sub-portion 2312 each constitute an electrical contact pointpair 203 with an electrical contact point 2023 of an adjacent firstconnection sub-portion row 2310. The second connection sub-portions 2312forming the electrical contact point pairs 203 with a same firstconnection sub-portion row 2310 are respectively located on both sidesof the first connection sub-portion row 2310 in the second direction andare respectively located at both ends of the first connectionsub-portion row 2310 in the first direction. Referring to FIG. 9 to FIG.10 and FIG. 1, the two end portions of the second connectionsub-portions 2312 are respectively located in the notches 2313 oppositeto each other at the end portions of the adjacent two first connectionsub-portion rows 2310, to connect the adjacent first connectionsub-portion rows 2310 by the light-emitting diode chips 300. Inaddition, the second connection sub-portions 2312 connected with a samefirst connection sub-portion row 2310 by the light-emitting diode chips300 are respectively located on both sides of the first connectionsub-portion row 2310 in the second direction and are respectivelylocated at both ends of the first connection sub-portion row 2310 in thefirst direction. The first connection sub-portion row in the exampleshown in FIG. 11 has same features as the first connection sub-portionrow shown in FIG. 3, the position relationship between the firstconnection sub-portion row and the second connection sub-portion shownin FIG. 11 is the same as the position relationship between the firstconnection sub-portion row and the second connection sub-portion shownin FIG. 3, which will be omitted here.

FIG. 12 is a partial structural schematic diagram of a connection linesub-unit provided by another example of the embodiment of the presentdisclosure. In some examples, as shown in FIG. 12, each of the firstconnection sub-portion rows 2310 comprises a plurality of firstconnection sub-portions 2311; and a connection region 2314 of one firstconnection sub-portion 2311 of adjacent first connection sub-portions2311 is located in the notch 2313 of the other first connectionsub-portion 2311 of the adjacent first connection sub-portions 2311.Referring to FIG. 5 and FIG. 12, the adjacent connection regions 2314are connected by the light-emitting diode chip 300. The first connectionsub-portion row according to this embodiment has same features as thefirst connection sub-portion row shown in FIG. 5, which will be omittedhere.

In some examples, as shown in FIG. 11 to FIG. 12, except the connectionregions 2314 located at both ends of the first connection sub-portionrow 2310, a size D of the first connection sub-portion row 2310 inrespective positions in the first direction is substantially equal alongthe second direction.

In some examples, as shown in FIG. 9 to FIG. 10, at least one connectionline sub-unit 201 comprises a plurality of connection line sub-units201; and the plurality of the connection line sub-units 201 share thefirst connection portion 210 and the second connection portion 220.Referring to FIG. 1 to FIG. 2 and FIG. 9 to FIG. 10, the plurality ofthe connection line sub-units 201 share the first connection portion 210and the second connection portion 220, so as to be connected inparallel, that is, the plurality of the connection line sub-units 201share the first connection portion 210 and the second connection portion220 so that the plurality of the light-emitting sub-units 101 areconnected in parallel.

In some examples, as shown in FIG. 9 to FIG. 12, a first connectionportion 210 comprises a first protrusion portion 212, an electricalcontact point 2021 of the first connection portion 210 is located on thefirst protrusion portion 212, and the first protrusion portion 212 islocated within a notch 2313 corresponding to a connection region 2314 ofa first connection sub-portion row 2310 adjacent to the first protrusionportion 212, so that an electrical contact point 2021 on the firstprotrusion portion 212 and an electrical contact point 2023 in theconnection region 2314 of the first connection sub-portion row 2310constitute an electrical contact point pair 202; a second connectionportion 220 comprises a second protrusion portion 222, an electricalcontact point 2022 of the second connection portion 220 is located onthe second protrusion portion 222, and the second protrusion portion 222is located within a notch 2313 corresponding to a connection region 2314of a first connection sub-portion row 2310 adjacent to the secondprotrusion portion 222, so that the electrical contact point 2022 on thesecond protrusion portion 222 and an electrical contact point 2023 inthe connection region 2314 of the first connection sub-portion row 2310constitute an electrical contact point pair 202.

Referring to FIG. 1 to FIG. 6 and FIG. 9 to FIG. 12, the firstprotrusion portion 212 of the first connection portion 210 extends intothe notch 2313 of the first connection sub-portion row 2310, so that thefirst electrical contact point 2021 of the first connection portion 210and the third electrical contact point 2023 of the third connectionportion 230 are respectively electrically connected with an anode 310and a cathode 320 of a light-emitting diode chip 300. The secondprotrusion portion 222 of the second connection portion 220 extends intothe notch 2313 of the first connection sub-portion row 2310, so that thesecond electrical contact point 2022 of the second connection portion220 and the third electrical contact point 2023 of the third connectionportion 230 are respectively electrically connected with an anode 310and a cathode 320 of a light-emitting diode chip 300. The position andconnection relationship between the first connection portion and thefirst connection sub-portion row according to this embodiment is thesame as the position and connection relationship between the firstconnection portion and the first connection sub-portion row shown inFIG. 1 to FIG. 6, and the position and connection relationship betweenthe second connection portion and the first connection sub-portion rowaccording to this embodiment is the same as the position and connectionrelationship between the second connection portion and the firstconnection sub-portion row shown in FIG. 1 to FIG. 6, which will beomitted here.

For example, the connection line unit of the glass-based circuit boardprovided by this embodiment can further comprise the connection portionshown in FIG. 7; FIG. 7 and the related description can be referred tofor a specific structure of the connection line unit, which will beomitted here.

For example, the glass-based circuit board provided by this embodimentfurther comprises a plurality of wirings 500 parallel to each other on aside of the connection line unit 200 facing the base substrate 100(i.e., the glass substrate 10) as shown in FIG. 6 and FIG. 8; and thewirings 500 comprise a plurality of first wirings 510 and a plurality ofsecond wirings 520. The first input end 211 of the connection line unit200 is connected with the first wiring 510, and the second input end 221of the connection line unit 200 is connected with the second wiring 520.The wiring 500, for example, extends along the second direction. Thewiring provided by this embodiment has same features as the wiring shownin FIG. 6 and FIG. 8, which will be omitted here.

For example, the glass-based circuit board provided by this embodimentfurther comprises a first insulation layer 600 located between thewirings 500 and the connection line unit 200 shown in FIG. 6 and FIG. 8,to have an insulation function. The first insulation layer provided bythis embodiment has same features as the first insulation layer shown inFIG. 6 and FIG. 8, which will be omitted here.

For example, the glass-based circuit board provided by this embodimentfurther comprises a reflective layer 400 located between the connectionline unit 200 and the plurality of light-emitting diode chips 300 shownin FIG. 6 and FIG. 8. The reflective layer provided by this embodimenthas same features and functions as the reflective layer shown in FIG. 6and FIG. 8, which will be omitted here.

For example, the glass-based circuit board provided by this embodimentfurther comprises a second insulation layer 700 located between thereflective layer 400 and the connection line unit 200 shown in FIG. 6and FIG. 8, to isolate the reflective layer 400 and the connection lineunit 200 from each other. The second insulation layer provided by thisembodiment has same features as the second insulation layer shown inFIG. 6 and FIG. 8, which will be omitted here.

For example, the glass-based circuit board provided by this embodimentcan further comprise a printed circuit board 900 shown in FIG. 6; andthe circuit board is configured to be electrically connected with thefirst wiring and the second wiring, to implement driving the connectionline unit in region division. The circuit board provided by thisembodiment has same features and functions as the circuit board shown inFIG. 6, which will be omitted here.

In some examples, as shown in FIG. 9 to FIG. 12, the electrical contactpoint pairs in each of the connection line units 200 are evenlydistributed so that the evenly distributed plurality of thelight-emitting diode chips 300 shown in FIG. 1 to FIG. 6 can beconnected with the plurality of the electrical contact point pairs inone-to-one correspondence.

For example, the positions of the respective connection portions and thepositions of the respective electrical contact point pairs in theconnection line unit 200 on the glass-based circuit board according tothe embodiment of the present disclosure are designed according to thepositions of the light-emitting diode chips 300. In the embodiment ofthe present disclosure, in order to implement better current carryingcapacity of the respective connection portions, a line width of therespective connection portions in a direction perpendicular to anextension direction of the respective connection portions can be setgreater; however, it can be considered to make a distance betweenadjacent connection portions not less than 15 microns while increasingthe line width as wide as possible. For example, the respectiveconnection portions are spread all over the glass substrate in a case inwhich a distance between the connection portions is not less than 15microns, which can ensure flatness of the entire glass-based circuitboard.

For example, in a direction perpendicular to the glass substrate 10, athickness of the glass-based circuit board is not greater than 8millimeters, to be capable to ensure that the thickness of the backplaneincluding the above-described glass-based circuit board is relativelythin.

The glass-based circuit board according to the above-describedembodiment of the present disclosure can be a circuit board forconnecting light-emitting diodes in the backplane according to theabove-described embodiment, and therefore, the related description ofthe glass-based circuit board according to the embodiment of the presentdisclosure can all be applied to the backplane according to theembodiment of the present disclosure, and the related description of thebackplane according to the embodiment of the present disclosure can allbe applied to the glass-based circuit board according to the embodimentof the present disclosure as well.

The glass-based circuit board provided by the embodiment of the presentdisclosure can be applied to a backlight source, and can also be appliedto a display panel. In addition, the backplane provided by embodimentsof the present disclosure can reduce the fabrication costs and thedriving costs.

The following statements should be noted:

(1) The accompanying drawings involve only the structure(s) inconnection with the embodiment(s) of the present disclosure, and otherstructure(s) can be referred to common design(s).

(2) In case of no conflict, features in one embodiment or in differentembodiments can be combined.

What are described above is related to the illustrative embodiments ofthe disclosure only and not limitative to the scope of the disclosure;the scopes of the disclosure are defined by the accompanying claims.

The invention claimed is:
 1. A backplane, comprising: a base substrate;a plurality of light-emitting units, arranged in an array on the basesubstrate, wherein each of the plurality of the light-emitting unitscomprises at least one light-emitting sub-unit; the at least onelight-emitting sub-unit comprises a connection line and a plurality oflight-emitting diode chips connected with the connection line; theplurality of the light-emitting diode chips are located on a side of theconnection line away from the base substrate; and the plurality of thelight-emitting diode chips in the at least one light-emitting sub-unitare connected in series, wherein in each of the light-emittingsub-units, the connection line comprises a first connection portion anda second connection portion; the first connection portion comprises afirst input end; the second connection portion comprises a second inputend; and the first connection portion and the second connection portionrespectively comprise an electrical contact point; the connection linefurther comprises a third connection portion; both ends of the thirdconnection portion respectively comprise an electrical contact point;the electrical contact point at one end of the third connection portionand the electrical contact point of the first connection portionconstitute an electrical contact point pair; the electrical contactpoint at the other end of the third connection portion and theelectrical contact point of the second connection portion constitute anelectrical contact point pair; and each of the electrical contact pointpairs is respectively connected with an anode and a cathode of one ofthe plurality of the light-emitting diode chips in one-to-onecorrespondence, wherein in each of the light-emitting sub-units, thethird connection portion comprises a plurality of connectionsub-portions; both ends of each of the connection sub-portionsrespectively comprise an electrical contact point; the electricalcontact points at adjacent ends of adjacent connection sub-portionsconstitute an electrical contact point pair; each of the electricalcontact point pairs is respectively connected with an anode and acathode of one of the plurality of the light-emitting diode chips inone-to-one correspondence; and the plurality of the connectionsub-portions are connected in series by the light-emitting diode chips,wherein the plurality of the connection sub-portions comprise a firstconnection sub-portion and a second connection sub-portion, the firstconnection sub-portion extends along a first direction parallel to thebase substrate; the first connection sub-portion has a shape in whichnotches are formed at two corners of a substantially rectangular shapethat are opposite to each other in a diagonal direction; the firstconnection sub-portion comprises connection regions corresponding to thenotches; and the electrical contact point of the first connectionsub-portion is located on a side of the connection region facing thenotch, the second connection sub-portion extends along the seconddirection parallel to the base substrate and intersecting with the firstdirection; the electrical contact points of the second connectionsub-portion are located at both end portions of the second connectionsub-portion in the second direction.
 2. The backplane according to claim1, wherein the light-emitting sub-unit comprises a plurality of firstconnection sub-portion rows extending along the first direction andarranged in the second direction; each of the first connectionsub-portion rows comprises at least one first connection sub-portion;two end portions of the second connection sub-portion are respectivelylocated in notches opposite to each other at end portions of adjacentfirst connection sub-portion rows, so that the adjacent first connectionsub-portion rows are connected with each other by the second connectionsub-portion and the light-emitting diode chips, the second connectionsub-portions connected with a same first connection sub-portion row bythe light-emitting diode chips are respectively located on both sides ofthe same first connection sub-portion row in the second direction andare respectively located at both ends of the same first connectionsub-portion row in the first direction.
 3. The backplane according toclaim 2, wherein each of the first connection sub-portion rows comprisesa plurality of the first connection sub-portions; and a connectionregion of one first connection sub-portion of adjacent first connectionsub-portions is located in the notch of the other first connectionsub-portion of the adjacent first connection sub-portions, so that theadjacent connection regions are electrically connected by thelight-emitting diode chip.
 4. The backplane according to claim 2,wherein each of the first connection sub-portion rows comprises a firstend portion and a second end portion; the first end portions of theplurality of the connection sub-portion rows are aligned in the seconddirection; the second end portions of the plurality of the firstconnection sub-portion rows are aligned in the second direction; and theplurality of the first connection sub-portion rows and the secondconnection sub-portions are integrally connected in a square wave shape.5. The backplane according to claim 2, wherein the first connectionportion comprises a first protrusion portion; the first protrusionportion is located within the notch at the connection region of thefirst connection sub-portion row connected with the first protrusionportion by the light-emitting diode chip; the second connection portioncomprises a second protrusion portion; and the second protrusion portionis located within the notch at the connection region of the firstconnection sub-portion row connected with the second protrusion portionby the light-emitting diode chip.
 6. The backplane according to claim 1,wherein the at least one light-emitting sub-unit comprises a pluralityof light-emitting sub-units; and the plurality of the light-emittingsub-units of each of the light-emitting units share the first connectionportion and the second connection portion, so that the plurality of thelight-emitting sub-units are connected in parallel.
 7. The backplaneaccording to claim 1, further comprising: a reflective layer, locatedbetween the connection line and the light-emitting diode chip.
 8. Thebackplane according to claim 7, further comprising: a plurality ofwirings parallel to each other, located on a side of the connection linefacing the base substrate, and including a plurality of first wiringsand a plurality of second wirings; a first insulation layer between theplurality of the wirings parallel to each other and the connection line;a second insulation layer between the reflective layer and theconnection line, to isolate the reflective layer and the connection linefrom each other, wherein the first input end of the connection line isconnected with the first wiring, and the second input end of theconnection line is connected with the second wiring.
 9. The backplaneaccording to claim 8, wherein a thickness of the wiring is greater thana thickness of the connection line, and widths of both of the firstconnection portion and the second connection portion are greater than awidth of the wiring.
 10. A glass-based circuit board, comprising: aglass substrate; and a plurality of connection line units, arranged inan array on the glass substrate; wherein, each of the connection lineunits comprises at least one connection line sub-unit; the connectionline sub-unit comprises a plurality of electrical contact point pairs;each of the electrical contact point pairs is configured to be connectedwith an anode and a cathode of a light-emitting diode chip in one-to-onecorrespondence, so that a plurality of light-emitting diode chipsconnected with the plurality of electrical contact point pairs areconnected in series, wherein the connection line sub-unit comprises afirst connection portion and a second connection portion; the firstconnection portion comprises a first input end; the second connectionportion comprises a second input end; and the first connection portionand the second connection portion respectively comprise an electricalcontact point; the connection line sub-unit further comprises a thirdconnection portion; both ends of the third connection portionrespectively comprise an electrical contact point; the electricalcontact point at one end of the third connection portion and theelectrical contact point of the first connection portion constitute theelectrical contact point pair; the electrical contact point at the otherend of the third connection portion and the electrical contact point ofthe second connection portion constitute the electrical contact pointpair, wherein in each of the connection line sub-units, the thirdconnection portion comprises a plurality of connection sub-portions;both ends of each of the connection sub-portions respectively comprisean electrical contact point; the plurality of the connectionsub-portions are adjacent head to tail, so that adjacent electricalcontact points of the adjacent connection sub-portions constitute theelectrical contact point pair, wherein the plurality of the connectionsub-portions comprise a first connection sub-portion and a secondconnection sub-portion, the first connection sub-portion extends along afirst direction parallel to the glass substrate; the first connectionsub-portion has a shape in which notches are formed at two corners of asubstantially rectangular shape that are opposite to each other in adiagonal direction; the first connection sub-portion comprisesconnection regions corresponding to the notches; and the electricalcontact point of the first connection sub-portion is located on a sideof the connection region facing the notch, the second connectionsub-portion extends along a second direction parallel to the glasssubstrate and intersecting with the first direction; electrical contactpoints of the second connection sub-portion are located at both endportions of the second connection sub-portion in the second direction.11. The glass-based circuit board according to claim 10, wherein theconnection line sub-unit comprises a plurality of first connectionsub-portion rows extending along the first direction and arranged in thesecond direction; each of the first connection sub-portion rowscomprises at least one first connection sub-portion; two end portions ofthe second connection sub-portion are respectively located in notches atend portions of adjacent first connection sub-portion rows, so that theelectrical contact points at the two end portions of the secondconnection sub-portion respectively constitute the electrical contactpoint pair with the electrical contact point of an adjacent firstconnection sub-portion row, the second connection sub-portions formingthe electrical contact point pairs with a same first connectionsub-portion row are respectively located on both sides of the firstconnection sub-portion row in the second direction and are respectivelylocated at both ends of the first connection sub-portion row in thefirst direction.
 12. The glass-based circuit board according to claim11, wherein each of the first connection sub-portion rows comprises aplurality of first connection sub-portions; and the connection region ofone first connection sub-portion of adjacent first connectionsub-portions is located in the notch of the other first connectionsub-portion.
 13. The glass-based circuit board according to claim 11,wherein the first connection portion comprises a first protrusionportion, the electrical contact point of the first connection portion islocated on the first protrusion portion, and the first protrusionportion is located within the notch corresponding to the connectionregion of the first connection sub-portion row adjacent to the firstconnection portion, so that the electrical contact point on the firstprotrusion portion and the electrical contact point in the connectionregion of the first connection sub-portion row constitute the electricalcontact point pair; the second connection portion comprises a secondprotrusion portion, the electrical contact point of the secondconnection portion is located on the second protrusion portion, and thesecond protrusion portion is located within the notch corresponding tothe connection region of the first connection sub-portion row adjacentto the second protrusion portion, so that the electrical contact pointon the second protrusion portion and the electrical contact point in theconnection region of the first connection sub-portion row constitute theelectrical contact point pair.
 14. The glass-based circuit boardaccording to claim 8, wherein the at least one connection line sub-unitcomprises a plurality of connection line sub-units; and the plurality ofthe connection line sub-units in each of the connection line units sharethe first connection portion and the second connection portion.